MPN: M323R1GB4PB0-CWMOD·By: Samsung
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The Samsung M323R1GB4PB0-CWMOD is an 8GB DDR5-5600MHz Non-ECC Unbuffered DIMM memory module designed for high-performance computing environments. Featuring a single rank x16 (1Rx16) configuration, 288-pin UDIMM form factor, and low 1.1V operation, it delivers enhanced bandwidth and power efficiency over DDR4. With CAS Latency (CL) of 46, it supports speeds up to 5600MT/s, making it suitable for workstations, gaming systems, and entry-level servers requiring non-ECC memory. The module utilizes Samsung's advanced DDR5 technology for improved thermal management and reliability. Key benefits include higher data throughput for memory-intensive applications like content creation, virtualization, and AI workloads. It is compatible with Intel 12th/13th Gen Core and AMD Ryzen 7000 series platforms supporting DDR5 UDIMM. Operating at standard JEDEC timings, it ensures plug-and-play installation without BIOS modifications in supported systems. This module addresses the growing demand for DDR5 in professional and prosumer segments, offering a balance of capacity, speed, and cost for upgrades from DDR4 systems.
| Manufacturer part # | M323R1GB4PB0-CWMOD |
|---|---|
| Brand | Samsung |
| Condition | New |
| ECC | Non-ECC Unbuffered |
| Speed | 5600MHz / PC5-5600 / 5600MT/s |
| Capacity | 8GB |
| Buffer Type | Unbuffered |
| CAS Latency | CL46 |
| Memory Type | DDR5 SDRAM |
| JEDEC Standard | DDR5-5600 compliant |
| Rank Configuration | 1Rx16 Single Rank x16 |
Compatible with modern desktop/workstation platforms from Intel and AMD supporting DDR5 UDIMM. Works with Windows 11, Linux distributions, and virtualization software.
Z790 chipset with DDR5 support
X670/B650 motherboards
4x DDR5 UDIMM slots
CAD/CAE applications like AutoCAD, SolidWorks, and Adobe Suite requiring high memory bandwidth for 3D modeling and rendering.
Video editing in Premiere Pro, DaVinci Resolve, and 3D animation in Blender benefiting from DDR5 sequential throughput.
High-refresh-rate gaming with AMD Ryzen 7000 or Intel 13th Gen CPUs supporting DDR5 UDIMM speeds up to 5600MHz.
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[email protected]| Voltage | 1.1V |
|---|
| Pin Count | 288-pin |
|---|---|
| Form Factor | 288-pin UDIMM |
| Module Width | Standard DIMM width |
| Operating Temperature | 0°C to 85°C |
|---|
Lightweight KVM or Hyper-V hosts running multiple development VMs with non-ECC memory tolerance.
TensorFlow/PyTorch training on desktop workstations with GPU acceleration needing fast system memory.
Compilation and testing environments for large codebases in Visual Studio or IntelliJ with memory-intensive builds.
Compatible with Intel 12th/13th/14th Gen Core (Alder Lake/Raptor Lake/Meteor Lake) and AMD Ryzen 7000/8000/9000 series (Zen4/Zen5) motherboards featuring DDR5 UDIMM slots. Requires BIOS support for 5600MHz operation; runs at reduced speeds on DDR5-4800/5200 boards.
Non-ECC Unbuffered memory designed for consumer/workstation use where maximum performance takes precedence over data integrity. Includes on-die ECC for signal integrity but lacks system-level error correction found in server RDIMMs.
CL46 timings at 1.1V operating voltage per JEDEC DDR5 specifications. The low voltage reduces power draw by 20-30% vs DDR4 while PMIC integration maintains stability during overclocking or heavy workloads.
Yes, identical modules in pairs enable dual-channel mode doubling bandwidth to 89.6GB/s at 5600MT/s. Samsung modules match perfectly for optimal performance without manual training.
Standard 288-pin UDIMM dimensions: 133.35mm length x 31.25mm height x 3.9mm thick. Fits all standard desktop cases and motherboard slots without cooler clearance issues.
JEDEC-standard timings with potential Intel XMP 3.0 or AMD EXPO profiles for easy overclocking to 6000+MHz on capable platforms. Samsung's factory binning ensures stability at rated speeds.
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