MPN: P41858-001·By: HPE
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We'll confirm availability and pricing for P41858-001, usually within one business day.
We'll confirm availability and pricing for P41858-001, usually within one business day.
The HPE P41858-001 is an AMD Instinct MI250X graphics accelerator designed for high-performance computing (HPC), AI training, and exascale workloads in datacenter environments. Featuring CDNA2 architecture on TSMC 6nm process, it delivers 14,080 stream processors across 220 compute units with peak performance of 383 TFLOPs FP16, 95.7 TFLOPs FP64 matrix, and 47.9 TFLOPs FP64 scalar. Equipped with 128GB HBM2e memory at 3.2 TB/s bandwidth via 8192-bit interface, it supports full-chip ECC for reliability in mission-critical applications. The OAM module form factor with PCIe 4.0 x16 interface and 8 Infinity Fabric links at 100 GB/s enables high-bandwidth multi-GPU scaling. TDP ranges from 500W to 560W peak with passive cooling. Compatible with HPE ProLiant servers and AMD ROCm software stack, it accelerates deep learning, scientific simulations, and large-scale data analytics. RAS features including page retirement ensure datacenter-grade uptime. Ideal for hyperscale cloud providers and research institutions requiring extreme compute density and memory capacity for complex models.
| Manufacturer part # | P41858-001 |
|---|---|
| Brand | HPE |
| Condition | New |
| Model | Instinct MI250X |
| Memory ECC | Yes - Full-Chip |
| Lithography | TSMC 6nm FinFET |
| RAS Support | Yes with Page Retirement |
| Product Line | AMD Instinct MI200 Series |
| Product Type | GPU Accelerator - Datacenter OAM Module |
| Compute Units | 220 |
| GPU Architecture | CDNA2 |
| Stream Processors |
Optimized for HPE ProLiant Gen10+ servers with AMD EPYC processors. ROCm support on major Linux distributions for datacenter HPC/AI.
PCIe 4.0 slots with latest iLO firmware
Optimized for GPU-dense configurations
PCIe 5.0 backward compatible
Scientific computing and weather modeling using AMD ROCm with high FP64 performance (47.9 TFLOPs) and 128GB HBM2e for large datasets in CFD and molecular dynamics.
Deep learning model training on frameworks like PyTorch ROCm with 383 TFLOPs FP16 and bfloat16 support, leveraging Infinity Fabric for multi-GPU scaling.
Hyperscale datacenter deployments for Frontier-like supercomputers requiring CDNA2 architecture, 3.2 TB/s memory bandwidth, and RAS features.
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[email protected]| 14,080 |
| Peak FP16 Performance | 383 TFLOPs |
|---|
| Peak FP64 Performance | 47.9 TFLOPs |
|---|
| Peak INT8 Performance | 383 TOPs |
|---|
| Peak FP64 Matrix Performance | 95.7 TFLOPs |
|---|
| Memory Size | 128 GB HBM2e |
|---|---|
| Memory Clock | 1.6 GHz |
| Memory Bandwidth | 3.2 TB/s |
| Memory Interface | 8192-bit |
| Peak Engine Clock | 1700 MHz |
|---|
| TDP | 500W nominal; 560W peak |
|---|
| Weight | 3.00 lb |
|---|---|
| Dimensions | 10.00in x 8.00in x 4.00in |
| Form Factor | OAM Module - PCIe 4.0 x16 |
| Cooling | Passive OAM |
|---|
| Bus Interface | PCIe 4.0 x16 |
|---|---|
| Infinity Fabric Links | 8 links - 100 GB/s peak bandwidth |
Graph analytics and database acceleration with high memory capacity and ECC support for error-free processing of massive datasets.
Genomics and physics simulations in research clusters using 220 compute units and PCIe 4.0 x16 for integration with EPYC servers.
Peak performance includes 383 TFLOPs FP16/bfloat16, 95.7 TFLOPs FP64 matrix, 47.9 TFLOPs FP64 scalar, and 383 TOPs INT8. Built on CDNA2 with 14,080 stream processors, it's optimized for HPC simulations and AI training workloads requiring high precision and throughput.
128GB HBM2e memory with 8192-bit interface at 1.6 GHz clock delivers 3.2 TB/s bandwidth. Full-chip ECC ensures data integrity for long-running datacenter jobs, making it suitable for memory-intensive applications like large language models and scientific computing.
OAM module form factor with PCIe 4.0 x16 host interface and 8 Infinity Fabric links providing 100 GB/s bandwidth. Passive cooling design integrates into high-density HPE ProLiant servers for multi-GPU configurations.
Supports AMD ROCm open software stack for AI frameworks including PyTorch, TensorFlow, and HIP. Includes RAS features like page retirement for production datacenter reliability and compatibility with major HPC applications.
TDP of 500W nominal with 560W peak, utilizing passive OAM cooling. This air-cooled design reduces complexity in rack-scale deployments while maintaining thermal performance under sustained high-utilization workloads.
Yes, designed for exascale HPC with CDNA2 architecture matching Frontier supercomputer specs. High FP64 performance, Infinity Fabric scaling, and ECC memory make it ideal for DOE-class scientific simulations and large-scale research clusters.
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